As the elapse of time, smartphone component hard to avoid can appear wear away or the phenomenon that ageing ebbs. Plus had fallen, component is very easy empty solder. The client delivers an IPhone7P today, descriptive breakdown is to switch on the mobile phone very slow, recording function have more than is needed, avoid carry switch to cannot be opened show gray.
Take a mobile phone to switch on the mobile phone detect, discovery opens recording interface to cannot find frequency equipment, appear in big frequency IC according to maintaining experience to be informed a problem this.
This is 7P advocate board design blemish, understand ill trouble, big frequency solder dish fall to drop a point easily, fall to break a line very easily to bring about afterwards without recording, without avoid carry, do not have ring even.
Big frequency of IPhone mobile phone is in charge of recording reaching call part, processing hind gives CPU, base band CPU respectively. Client description has had fallen, considering the case that has a line to drop a point, pull down big frequency IC.
The discovery after pulling down breaks a string as expected, find a problem with respect to easy to handle.
Fly directly line.
Had flown mount of line general frequency, switch on the mobile phone test. Recording is normal, avoid it is normal to carry, maintenance ends.